INTRODUCING
THERM-A-GAP PAD 120LOE
12.0 W/m-K High Performance, Low Oil Bleed, Low Relaxation Force Thermal Gap Filler Pad
Parker Chomerics THERM-A-GAP PAD 120LOE is a high performance, low oil bleed, thermal gap filler pad with 12.0 W/m-K thermal conductivity. PAD 120LOE was developed to be a high reliability and long-term solution for mission critical and high-performance electronics in nearly every market segment including advanced computing, defense electronics, telecommunications infrastructure, and automotive modules.
“LO” in the product name stands for “Low Oil”, indicating the very low silicone oil bleed and migration properties of this gap pad. PAD 120LOE is manufactured to minimize oil bleed and was formulated based on several different test methods during product development. It is meant to be used where the aesthetic or manufacturing issues of silicone oils can be a concern.
PAD 120LOE has a hardness of Shore 00 45 and exhibits excellent stress relaxation over time. It is designed to impart minimal stress on components such as integrated circuits and provide physical protection such as vibration dampening while maintaining effective thermal contact where conformability in gaps or rough surface texture is a concern.
PAD 120LOE can be provided in sheets or die cut to custom part sizes and is available in standard thicknesses from 1 to 5 millimeters.
Product Features
- High thermal performance: 12.0 W/m-K conductivity
- Very low oil bleed and migration
- Very low compression force post relaxation
- High tack surface reduces contact resistance
- Electrically isolating
- UL 94 V-0 flammability rating
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THERM-A-GAP
PAD 120LOE
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High Thermal Performance with Low Oil Migration
Introducing THERM-A-GAP PAD 120LOE. To create this innovative material, we've taken the chemistry of some of our other materials and improved the thermal connectivity to create a higher performance material reaching 12 w/mK.
Higher Reboundability for IT and Testing Applications
To achieve reboundable performance, we took the formulation of THERM-A-GAP PAD 30 and modified some of the polymers within the binder system to make them rebound a little bit faster. PAD 30RB is in line with many of the current thermal performance needs required by electronics applications.
Thermal Solutions for Tight Semiconductor Cavities
At Parker Chomerics, we’re continually innovating to help our clients meet their applications’ thermal management needs. One specific area of focus for us is thermal phase change materials, which typically start as a solid or paste then go through a phase transition and effectively melt once they are heated.
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Modern data centers, which often include secure facilities and shielded rooms, have many requirements to keep them performing optimally and continuously. In applications where there are high-security environments or that contain confidential information, there are many individual buildings and rooms that must be EMI shielded while maintaining proper air flow and air handling. Learn how our honeycomb vent panels meet these needs.
Embrace the Global Advantage in Manufacturing
EMC Considerations for Product Designers and Engineers
If you are a product designer or engineer who wants to know about the many solutions for electrmagnetic interference (EMI) shielding or simply wanted a refresher on the basics of EMC, this webinar is for you. You will learn the theory behind EMC, the products available to meet EMC regulations, the basics of testing for EMI/RF compliance, and hear about real-world application examples.
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