In manufacturing production facilities, every fraction of a section counts. Parts must be made and assembled quickly and correctly to meet customer demand and stay ahead of the competition.
To address this need and give our customers a competitive advantage, we’re proud to introduce THERM-A-GAP™ GEL 60HF. Part of the Parker Chomerics family of fully cured, silicone-based, dispensable thermal interface materials, this innovative gel is designed for high-performance heat transfer from electronics components to cooling features and flexible for use across industries and applications.
The “HF” in GEL 60HF stands for “High Flow,” and this product has earned that designation. It is ideal for high-volume dispensing applications and high throughput production operations, with thermal conductivity of 6.2 W/m-K and a flow rate of 80g/min. That’s three to four times the flow rate of other products which may only achieve flow rates of 20 g/min, marking a huge improvement in manufacturing.
Engineered for dispensing
THERM- A-GAP GEL 60HF is a single-component material. While some single-component materials have a reputation for being harder to dispense, THERM- A-GAP rises above, matching the increased flow benefits of two-part materials. This improvement provides manufacturers with the best of both worlds, enjoying the quick curing process absence of a curing process of a single-component material with the improved flow rate of a double-component material.
As with all Parker Chomerics thermal gels, THERM- A-GAP GEL 60HF is optimized for automated dispensing at various packaging sizes while retaining properties for easy rework and field repair situations. Its paste-like consistency enables very tightly controlled dispensing and accurate material placement during assembly. Additionally, it requires low compressive force to deflect under assembly pressure, subjecting components, solder joints and PCB leads to minimal stress.