parker.com/Chomerics / Case Studies / Integrated Assembly Required for Automotive Instrument Gauge Cluster
CASE STUDY
Integrated Assembly Required for Automotive Instrument Gauge Cluster
Discover three challenges a global automotive supplier faced when designing an integrated gauge cluster assembly on an aluminum die cast housing, delivered as a single assembly for instrument cluster module.
BACKGROUND
The traditional automotive instrument cluster is rapidly changing as consumer demand has pushed the development of the analog instrument cluster into the new world of digital design. Many of these state-of-the-art designs are merging enhanced safety features and technologies once located in the traditional center stack driving many new challenges to the automotive supply base.
Manufacturers of automotive instrument clusters now face a major expansion of board level components, which will allow for the deployment of rich, dynamic graphical instrumentation while satisfying essential safety requirements such as ISO 26262.
Challenge #1: How to dissipate heat caused by the expansion of board level components coupled with sophisticated software.
The state-of-the-art designs are merging enhanced safety features and technologies once located in the traditional center stack requiring. High power graphical and processing chips are driving high heat issues within the instrument cluster assembly. Removing this heat from the sealed assembly is a new challenge facing automotive instrument cluster manufacturers.
Key Gauge Cluster Heat Dissipation Design Requirements
- Highly conformable and low compression
- Thermal conductivity of 5 W/m-K
- Vertical stability with no post assembly movement due to heat cycling and vibration
- Applied to heatsink by supplier and delivered ready for assembly
- Material must be visible to optical cameras on the assembly line
Thermal Solution Developed by Parker Chomerics
Application engineers at Parker Chomerics worked with a model of the housing component to determine the ideal material and softness required within the design specifications. FEA simulation is conducted to predict the reacting force of the thermal pad during and after its installation to the targeted location to ensure it would not cause deformation and/or damage to the PCB/IC during and after assembly.
Challenge #1 Final Conclusions
After extensive testing and trials, it was determined that Parker Chomerics THERM-A-GAP™ TC50 was the best thermal interface material to dissipate heat from the instrument cluster module. TC50 is a one component, dispensable, fully cured thermal interface material with minimal thermal resistance and high component reliability. It is also extremely suitable for high volume automated assembly lines where productivity is critical.
It has a bulk thermal conductivity of 5.0 W/m-K and is dark gray in color which can be easily recognized by optical cameras on the assembly line. TC50 does not need to cure, meaning it can be dispensed on the heat sink at Parker Chomerics and be delivered to the customer as a single assembly ready for their production line. Our customer was very pleased with their selection of TC50 and appreciated of Parker Chomerics' engineering services and manufacturing know-how to make it the project a success.
THERM-A-GAP TC50
Parker Chomerics THERM-A-GAP™ TC50 is a single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity
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Challenge #2: Sealed electronics requirements to block EMI noise.
With so many merging technologies located in a relatively confined space, electromagnetic interference (EMI) is a new challenge facing digital gauge cluster designers. Requirements call for an EMI gasket to provide shielding properties that both contains and blocks EMI noise from impacting board-level components.
EMI/RF Shielding Design Requirements
- Low compression of gasket
- 70 dB or greater EMI shielding effectiveness
- Robotically dispensed gasket with excellent adhesion to aluminum casting
- Applied to heat sink by supplier and delivered ready for assembly
- Material must be visible to optical cameras on the assembly line
- Long term durability and reliability
EMI/RF Shielding Solution
Application engineers at Parker Chomerics worked with a model of the instrument housing component and shielding requirement to determine the ideal material required within the design specifications. A finite element analysis (FEA) simulation was conducted to predict the correct bead size and shape to provide effective EMI shielding while maintaining the low closure force requirements of the module design.
Challenge #2 Conclusion and Next Steps
After extensive testing and trials, it was determined that Parker Chomerics CHO-FORM® 5513 Form-In-Place EMI Gasket was the best material for the instrument cluster module. CHO-FORM 5513 is a two-component, thermal cure silicone system providing greater than 70 dB shielding effectiveness and excellent adhesion to chromate coated aluminum surfaces.
CHO-FORM 5513 consists of a silver-copper particle filler and utilizes a thermal cure technology which allows for a minimal cure cycle of only 30 minutes at 140°C. It is also extremely suitable for high volume, automated assembly line where productivity is critical. CHO-FORM 5513’s dark gray color can be recognized by optical cameras on the assembly line allowing for hands free quality inspection.
The manufacturing company is very pleased with their selection of CHOFORM 5513 and appreciated of Parker Chomerics engineering and services to make it the project a success.
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Challenge #3: Complex Electronics Level Design and Manufacturing Requirements.
Tight tolerances and increased cleanliness requirements are impacting the manufacturing process for our customer. These designs have pushed the need for multiple dispensed materials, both thermal interface materials and form-in-place EMI shielding gaskets discussed above, increasing the manufacturing capital costs and technical expert resources.
INCREASED CAPITAL AND MANUFACTURING COSTS
- Dispensing equipment for both thermal interface materials and EMI gasket materials
- In-line automation providing error proof repeatability delivering zero defect parts
- Hands free dispense measurement data collection providing repeatable zero defect parts
- On-site dispensing, automation and measurement technical resources/personnel
SOLUTION
Using Parker Chomerics Integrated Solutions, our customer was able to take receipt of a single part number assembly containing both of the Parker Chomerics materials (THERM-A-GAP™ TC50 and CHO-FORM® 5513) dispensed on an aluminum heat sink casting.
CONCLUSION
Parker Chomerics state-of-the-art automated processing lines provide our customer with hundreds of thousands of dollars in capital cost savings. This is made possible thanks to our single part fully cured dispensed thermal material TC50. Additional benefit to our customer is Parker Chomerics global footprint with new state-of-the-art automated processing lines in North America, Europe and Asia providing global contingency plans and potentially in-region manufacturing solutions.
Get a Quote Now
Tell us a little bit about your problem and we'll do our best to come up with a cost effective, timely quote to help you get started.
- Request a Quote
- 781 935 4850
- choquotes@parker.com
- Find a Salesperson
- Find a Distributor
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