CASE STUDY
5G Base Station Thermal Management
A global manufacturer of 5G telecom base stations required effective thermal management using a high thermal conductivity dispensable thermal interface material to support increased capacity and connectivity for future traffic growth.
5G Thermal Management Customer Challenge
A global manufacturer of 5G telecom base stations required a high thermal conductivity dispensable thermal interface material (TIM) for increased heat dissipation required to support the capacity and connectivity for future traffic growth.
5G is enabled by high-powered, yet smaller-footprint devices which require the highest performing TIMs. The customer determined that a high-volume, robotically dispensable TIM was necessary that was rated to at least 7 W/m-K thermal conductivity and could withstand a wide range of temperature cycling as well as heat and humidity aging.
Critical Thermal Design Requirements
- Easy to dispense, no curing
- Low stress on sensitive antenna components
- Provide proper thermal dissipation
- Single component material
- Skin-free for 60 hours after dispensing
- Large vessel size for high volume automated dispensing
Key Customer Specific Requirements
- High thermal conductivity, at least 7 W/m-K
- Dispense solution (vendor, equipment)
- No change in thermal or mechanical properties after cycling to -40°C to 125°C
5G Thermal Interface Material Solution
The customer was able to share a sample printed circuit board design with Parker Chomerics, which was then replicated by our experienced Applications Engineering team using an in-house 3D printer.
The 3D printed prototype parts enhanced the five locations for dispensing, so that they could be correctly identified for precise dispense location.
Utilizing a dispensing system from our state-of-the-art applications engineering lab in Woburn, MA, THERM-A-GAP GEL 75 was selected for its high thermal conductivity and dispensed onto the 3D printed parts for trials and capabilities. The prototype parts were successful in representing the actual PCB.
The customer visited the applications lab to view the dispensing and determined that THERM-A-GAP GEL 75 would be ideal for their high-volume program.
Parker Chomerics THERM-A-GAP GEL 75 7.5 W/m-K thermal conductivity, no cure required, single component dispensable thermal compound.
Conclusion and Summary
Parker Chomerics selected THERM-A-GAP GEL 75 due to its combination of high thermal performance as well as its ability to be dispensed onto the complex parts with ease. Make the switch from thermal gap pads to a cost effective automated or semi-automated installation of thermal interface materials.
With our application engineering team's expertise in 3D printing prototype parts, along with our engineering lab which customers are encouraged to utilize, allowed the Parker Chomerics team to successfully provide a full solution to the customer within one week of receiving the customer's parts for trials.
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Parker Hannifin Chomerics Division
77 Dragon Ct., Woburn, MA 01801
781-935-4850