CHO-BOND 584-29
Two Component Easy To Use Conductive Epoxy Adhesive
Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required. CHO-BOND® 584-29 is a silver-colored epoxy designed to be used in very tight applications and around electrical components.
Features and Benefits
- Silver filler is a premium conductivity solution to electrical bonding
- Excellent conductivity levels (0.002 ohm-com)
- Strong adhesion properties (>1200 PSI lap shear strength)
- Thin paste makes it effective for easy dispensing from a small needle for small cracks and voids
- Fast cure at elevated temperatures (15 minutes at 113°C) and room temperature cure options
- Low volatile organic compounds
- Comes in standard sizes of pre-measured syringes so no mixing and measuring is required
Typical Applications
- Electrical enclosure bonding
- Electrical component grounding
- Cold soldering
- Sealing and bonding machined enclosures
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CHO-BOND 584-29
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EMC Considerations for Product Designers and Engineers
If you are a product designer or engineer who wants to know about the many solutions for electrmagnetic interference (EMI) shielding or simply wanted a refresher on the basics of EMC, this webinar is for you. You will learn the theory behind EMC, the products available to meet EMC regulations, the basics of testing for EMI/RF compliance, and hear about real-world application examples.
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