Introducing
THERM-A-GAP GEL 20
Parker Chomerics THERM-A-GAP™ GEL 20 is a dispensable gel that has 2.4 W/m-K Thermal Conductivity as a one component fully cured system.
Parker Chomerics THERM-A-GAP GEL 20 is a moderate performance, one component, dispensable thermal interface material with 2.4 W/m-K thermal conductivity developed with high reliability for the automotive industry.
The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses up to 4mm to suit application needs. THERM-A-GAP GEL 20 requires low compressive force to deform under assembly pressure, subjecting components, solder joints and leads to minimal stresses.
It is formulated to accommodate today’s high reliability requirements for thermal cycling & high temperature environments.
Product Features
- Thermal conductivity: 2.4 W/m-K
- Easily dispensed
- Low compression force
- No secondary cure required
- Excellent consistency and long term reliability
- Low oil bleeding
- Resists movement under vibration
- Superior Tackiness
Typical Applications
- Automotive electronic control units (ECUs)
- Converter & Inverter & OBC
- ADAS control Module
- Vehicle Infotainment
- Power Supplies & Semiconductors
- Memory & Power Modules
- Microprocessors / Graphics Processors
- Flat Panel Displays & Consumer Electronics
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THERM-A-GAP GEL 20
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Reliably Improve Application Performance With THERM-A-GAP GEL 20
Parker Chomerics THERM-A-GAP™ GEL 20 is a moderate-performance, one component, dispensable thermal interface material with 2.4 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure. It is specifically formulated to accommodate today’s high reliability requirements for thermal cycling and high temperature environments.
What Are THERM-A-GAP GELs?
THERM-A-GAP GELs are highly conformable, single-component thermal dispensable compounds that require no cure. Once dispensed, they hold their shape and are ideal for applications where stability and long term reliability is required. They are available in silicone and silicone-free formulations and are ideally suited for high volume applications.
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Parker Chomerics has been busy developing new, next-generation thermal interface materials specifically to help aid in the thermal cooling of consumer electronics devices. Successful thermal management of high-power electronic components (single chips, multi-chip modules, integrated circuits, etc.) with high heat dissipation ratings requires careful design engineering.
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