INTRODUCING
THERM-A-GAP GEL 20
2.4 W/m-K High Performance Fully Cured Dispensable Thermal Gap Filler Gel
Parker Chomerics THERM-A-GAP GEL 20 is a moderate performance, one component, dispensable thermal interface material with 2.4 W/m-K thermal conductivity developed with high reliability for the automotive industry.
The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses up to 4mm to suit application needs. THERM-A-GAP GEL 20 requires low compressive force to deform under assembly pressure, subjecting components, solder joints and leads to minimal stresses.
It is formulated to accommodate today’s high reliability requirements for thermal cycling & high temperature environments.
Product Features
- Thermal conductivity: 2.4 W/m-K
- Easily dispensed
- Low compression force
- No secondary cure required
- Excellent consistency and long term reliability
- Low oil bleeding
- Resists movement under vibration
- Superior Tackiness
Typical Applications
- Automotive electronic control units (ECUs)
- Converter & Inverter & OBC
- ADAS control Module
- Vehicle Infotainment
- Power Supplies & Semiconductors
- Memory & Power Modules
- Microprocessors / Graphics Processors
- Flat Panel Displays & Consumer Electronics
Get a Free Sample of
THERM-A-GAP GEL 20
We’re so confident about our products, we’ll give you the opportunity to try them out before purchase.
More THERM-A-GAP Thermal Gap Filler Pads
More Resources
Reliably Improve Application Performance With THERM-A-GAP GEL 20
Parker Chomerics THERM-A-GAP™ GEL 20 is a moderate-performance, one component, dispensable thermal interface material with 2.4 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure. It is specifically formulated to accommodate today’s high reliability requirements for thermal cycling and high temperature environments..
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