Introducing
THERM-A-GAP GEL 35VT
3.5 W/m-K High Reliability, Fully Cured, Dispensable Thermal Gel
Parker Chomerics THERM-A-GAP GEL 35VT is a reworkable, high performance, one-component silicone, dispensable thermal interface gel material with 3.5 W/m-K typical thermal conductivity. GEL 35VT was developed to conduct heat away from electronics to heat sinks or enclosures and to perform reliably in vertical and / or high vibration applications. The “VT” suffix in the product name stands for Vertical Tackiness.
During development, GEL 35VT was tested to a number of rigorous long term reliability tests such as automotive slump, high vibration testing, and telecommunications thermal verification processes. The long-term reliability of GEL 35VT provides confidence for mission critical applications that rely on consistent thermal performance over many years of continuous operation.
THERM-A-GAP GEL 35VT requires no mixing or secondary curing and is designed for easy application and rework. It can be dispensed at various bond line thicknesses typically up to 0.160in (4mm) to take up gaps created by assembly or manufacturing tolerances. As with all Parker Chomerics thermal gels, GEL 35VT is formulated to accommodate today’s high-performance and high reliability electronics while being ideal for automated dispensing machines, rework, and field repair situations.
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Related Products
THERM-A-GAP GEL 50VT
Parker Chomerics THERM-A-GAP™ GEL 50VT is a reworkable, high performance, one-component, dispensable thermal interface gel material with 5.2 W/m-K typical thermal conductivity. GEL 50VT was developed to conduct heat away from electronics to heat sinks or enclosures and to perform reliably in vertical and/or high vibration applications. The “VT” suffix in the product name stands for “Vertical Tackiness.”
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When Reliability Matters Most, Trust THERM-A-GAP™ GEL 50VT
THERM-A-GAP™ GEL 50VT, the newest addition to the THERM-A-GAP GEL family from Parker Chomerics, is our most reliable thermally conductive gel offering yet and the perfect fit for these challenging scenarios. Boasting 5.2 W/m-K thermal conductivity, this high-performance, one-component, dispensable thermal interface gel material was developed to conduct heat from electronics to heat sinks or enclosures and perform reliably in vertical, high-vibration, and harsh environments. It can be used in any industry where applications require reliability in harsh conditions.
Solutions for Gap Fillers
A type of thermal interface material known as a "gap filler" is specifically designed to fill large gaps between heat-generating and heat-dissipating surfaces. Gap filler materials can be selectively placed or used to cover multiple heat sources within a single application, and can be used at varying heights to displace air and provide effective cooling.
Selecting Between Thermal Gap Filler Pads and Thermal Gels
Discover the typical properties of thermal gap pads, also known as thermally conductive gap filler pads or simply just gap filler pads.
These soft, conformable pads are designed to reduce component stress and help with vibration dampening.
Different gap filler pads have different specifications depending on use of application, performance requirements, and much more. Watch the video to learn more about the properties of thermally conductive gap filler pads.
Embrace the Global Advantage in Manufacturing
EMC Considerations for Product Designers and Engineers
If you are a product designer or engineer who wants to know about the many solutions for electrmagnetic interference (EMI) shielding or simply wanted a refresher on the basics of EMC, this webinar is for you. You will learn the theory behind EMC, the products available to meet EMC regulations, the basics of testing for EMI/RF compliance, and hear about real-world application examples.
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