Introducing
THERM-A-GAP GEL 40NS
The highest thermal conductivity dispensable thermal interface material from Parker Chomerics. 4.0 W/m-K thermal conductivity with 30 g/min flow rate.
Parker Chomerics THERM-A-GAP™ GEL 40NS is a high-performance, one-component, urethane based, dispensable thermal interface gel material with 4.0 W/m-K thermal conductivity, developed to conduct heat from electronics to a heat sink or enclosure. This non-silicone thermal gel, hence the “NS” suffix, is ideal for applications where silicone contamination is an issue, such as optical systems or where silicone use is restricted. THERM-A-GAP™ GEL 40NS requires no mixing or curing and is designed for easy application and rework.
THERM-A-GAP™ GEL 40NS requires very low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses. It can be dispensed at various bond line thicknesses to take up gaps created by assembly or manufacturing tolerances.
As with all Parker Chomerics thermal gels, it is formulated to accommodate today’s high-performance and high-reliability electronics while being ideal for automated dispensing machines, and field repair situations
Product Features
- Thermal conductivity: 4.0 W/m-K
- Non-silicone (urethane based) binder system
- Easily dispensed
- No secondary curing required
- No pump out
- Low thermal impedance
- Very low compression force
- Reworkable
Typical Applications
- Automotive electronic control units (ECUs)
- Telecommunications base stations
- Power suppliers and semiconductors
- Memory and power modules
- Flat panel displays and consumer electronics
- Microprocessors and graphics processors
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THERM-A-GAP GEL 40NS
RESOURCES
Non-Silicone Dispensable Thermal Interface Material for SSD Modules
Without a doubt, the use of solid-state drives for data storage in computing applications will continue to grow for years to come. Advancements in device storage capacity and reading/writing speeds will lead to more powerful components that must be cooled to maintain long term reliability. All these trends have led to the development of a new, non-silicone, high performance, one-component, dispensable thermal interface material by Parker Chomerics known as GEL 40NS.
What Are THERM-A-GAP GELs?
THERM-A-GAP GELs are highly conformable, single-component thermal dispensable compounds that require no cure. Once dispensed, they hold their shape and are ideal for applications where stability and long term reliability is required. They are available in silicone and silicone-free formulations and are ideally suited for high volume applications.
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