Introducing
THERM-A-GAP GEL 50TBL
A thermally conductive gap filler
- The highest thermal conductivity thin bond line gap filler material from Parker Chomerics
- 5.0 W/m-K thermal conductivity with 30 g/min flow rate
Parker Chomerics THERM-A-GAP GEL 50TBL is a reworkable, high-performance thermal interface material with 5.0 W/m-K Bulk typical Thermal Conductivity. Part of a family of one-component dispensable gap fillers, GEL 50TBL was developed to conduct heat away from electronics to a heat sink or enclosure at very thin bond lines. The “TBL” suffix stands for Thin Bond Line, indicating that this material is meant for thin bond line applications. At minimum bond line thickness of 0.002” or 0.05mm, the Apparent Thermal Conductivity exceeds 11 W/m-K. THERM-A-GAP GEL 50TBL is a thermally conductive compound that requires no mixing or secondary curing and is designed for easy application and possible rework.
THERM-A-GAP GEL 50TBL requires very low compressive force to conform under assembly pressure, thereby subjecting components, solder joints and leads to minimal stresses. This thermal gel material is primarily designed for thin bond lines and is typically not intended to be used as a gap filler for gaps larger than .020 in (0.50mm) in electronics assemblies.
As with all Parker Chomerics thermal gels, GEL 50TBL is formulated to accommodate today’s high-performance thermal compound needs and suit high reliability electronics while being ideal for automated dispensing machines, rework, and field repair situations. Parker Chomerics is a global leader in designing and producing dispensable thermal gels and thermally conductive gap fillers.
Product Features of THERM-A-GAP GEL 50TBL, a Thermal Gap Filler
- Very thin bond line 0.002” (0.05mm) typical
- Bulk Thermal Conductivity: 5.0 W/m-K
- Apparent Thermal Conductivity at minimum bond line thickness: >11 W/m-K
- Low thermal impedance
- Very low compression force
- Reworkable
- Easily dispensed thermal paste
- No secondary curing required
- No pump out
Typical Applications for Thermally Conductive Gels
- Automotive electronic control units (ECUs)
- Telecommunications base stations
- Power electronics and semiconductors
- Memory and power modules
- LEDs and consumer electronics
- Microprocessors and graphics processors
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RESOURCES
The Next Generation of Thin Bond Line Thermal Interface Materials
Miniaturization. Higher Power. Higher Component Density. These are the trademarks of many modern electronic devices. While these trends are helping push the boundaries of what devices can do, they come with their fair share of challenges. Most notable of these challenges is the long-term reliability of electronics associated with a controlled operating temperature range. Thermal Interface materials (TIMs) are improving in lock step with modern electronics but must get more efficient and be able to operate in smaller gaps. THERM-A-GAP GEL 50TBL (TBL = Thin Bond Line) is the Parker Chomerics solution to thin bond line applications and an alternative to current greases and phase change materials (PCMs).
What Are THERM-A-GAP GELs?
THERM-A-GAP GELs are highly conformable, single-component thermal dispensable compounds that require no cure. Once dispensed, they hold their shape and are ideal for applications where stability and long term reliability is required. They are available in silicone and silicone-free formulations and are ideally suited for high volume applications.
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