Introducing
THERM-A-GAP GEL 60HF
THERM-A-GAP GEL 60HF is part of the Parker Chomerics family of fully cured, one component, silicone-based, dispensable thermal interface materials. With a 6.2 W/m-K thermal conductivity, it is designed for high performance heat transfer from electronics components to cooling features and meant to be used across industries and applications.
THERM-A-GAP GEL 60HF is part of the Parker Chomerics family of fully cured, one component, silicone-based, dispensable thermal interface materials. With a 6.2 W/m-K thermal conductivity, it is designed for high performance heat transfer from electronics components to cooling features and meant to be used across industries and applications.
The “HF” in GEL 60HF stands for “High Flow”, indicating that the material is ideal for high volume dispensing applications and high throughput production operations. As with all Parker Chomerics thermal gels, it is optimized for automated dispensing at various packaging sizes while retaining properties for easy rework and field repair situations.
The paste-like consistency of THERM-A-GAP GEL 60HF enables very tightly controlled dispensing and accurate material placement during assembly. It requires low compressive force to deflect under assembly pressure, subjecting components, solder joints and PCB leads to minimal stress.
Product Features
- Thermal conductivity: 6.2 W/m-K
- High flow rate: 80g/min
- No secondary curing required
- Low thermal impedance
- Very low compression force
- Reworkable
- Single component
- Room temperature storage
Typical Applications
- Consumer electronics
- Telecommunications equipment
- Energy storage devices
- Power electronics and modules
- Automotive control units and sensors
- Computing components (CPUs, GPUs, memory)
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THERM-A-GAP GEL 60HF
RESOURCES
Improve Assembly Efficiency with THERM-A-GAP™ GEL 60HF
In manufacturing production facilities, every fraction of a section counts. Parts must be made and assembled quickly and correctly to meet customer demand and stay ahead of the competition.
To address this need and give our customers a competitive advantage, we’re proud to introduce THERM-A-GAP™ GEL 60HF. Part of the Parker Chomerics family of fully cured, silicone-based, dispensable thermal interface materials, this innovative gel is designed for high-performance heat transfer from electronics components to cooling features and flexible for use across industries and applications.
What Are THERM-A-GAP GELs?
THERM-A-GAP GELs are highly conformable, single-component thermal dispensable compounds that require no cure. Once dispensed, they hold their shape and are ideal for applications where stability and long term reliability is required. They are available in silicone and silicone-free formulations and are ideally suited for high volume applications.
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