INTRODUCING
THERM-A-GAP PAD 30
3.2 W/m-K Thermally Conductive Very Low Compression Force Gap Filler Pad
Parker Chomerics THERM-A-GAP® PAD 30 is a thermally conductive, electrically isolating gap filler pad with a thermal conductivity of 3.2 W/m‐K. Designed to provide effective heat transfer between electronic devices, heat sinks, or other cooling features, THERM‐A‐GAP PAD 30 offers the ideal combination of heat transfer, low outgassing, and low compressing forces. With a Shore 00 hardness measurement of 30, it is designed to maintain conformability in gaps that contain uneven mating surfaces, air gaps, or where rough surface texture is a concern.
THERM‐A‐GAP PAD 30 was developed to be a universal solution across applications and industries requiring a moderate level of thermal performance in electronic device designs. It is a cost‐effective solution and optimized for flexibility of design with several material carrier options available and ease of customization to unique shapes and sizes.
Product Features
- 3.2 W/m-K thermal conductivity
- Very low compression force
- Very good thermal conductivity
- High tack surface reduces contact resistance
- “A” version offers high strength acrylic PSA for permanent attachment
- UL recognized V-0 flammability
- RoHS compliant
- Vibration dampening
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THERM-A-GAP PAD 30
More THERM-A-GAP Thermal Gap Filler Pads
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Higher Reboundability for IT and Testing Applications
To achieve reboundable performance, we took the formulation of THERM-A-GAP PAD 30 and modified some of the polymers within the binder system to make them rebound a little bit faster. PAD 30RB is in line with many of the current thermal performance needs required by electronics applications.
Thermal Solutions for Tight Semiconductor Cavities
At Parker Chomerics, we’re continually innovating to help our clients meet their applications’ thermal management needs. One specific area of focus for us is thermal phase change materials, which typically start as a solid or paste then go through a phase transition and effectively melt once they are heated.
Improved Thermal Management for Liquid Cooling Features in Data Centers
Parker Chomerics has several products that work well in these applications, including phase change materials and thermal greases. For applications with larger gaps, our thermal gap pads and thermal gels can be great choices as well.
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Thermal interface gap pads (thermal pads) remain one of the most widely used TIMs for bridging mechanical tolerances while maintaining reliable heat transfer—especially in EV power electronics, telecom, servers, and industrial controls. In this video, we cover the latest gap pad product trends and new developments shaping 2026, with practical guidance for selecting pads that perform and assemble consistently.
Embrace the Global Advantage in Manufacturing
EMC Considerations for Product Designers and Engineers
If you are a product designer or engineer who wants to know about the many solutions for electrmagnetic interference (EMI) shielding or simply wanted a refresher on the basics of EMC, this webinar is for you. You will learn the theory behind EMC, the products available to meet EMC regulations, the basics of testing for EMI/RF compliance, and hear about real-world application examples.
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