Introducing
THERM-A-GAP PAD 10
1.0 W/m-K High Performance Ultra Low Hardness
Thermal Gap Filler Pad
Parker Chomerics THERM-A-GAP® PAD 10 Thermally Conductive Gap Filler Pads provide an ultra low hardness (35 Shore 00) solution with 1.0 W/m-K of thermal conductivity. THERM-A-GAP gap-filler sheets and pads offer excellent thermal properties and the highest conformability at low clamping forces. THERM-A-GAP PAD 10 is an economical solution and is the highest conformability gap filler sheet.
THERM-A-GAP PAD 10 is available in various thicknesses and finished in standard sheets of 9”x9” or 18”x18”. Custom size configurations and die cut parts are available as individual parts or on sheets. To receive a quote on a custom size part, choose your thickness and carrier options, and then select “custom” size.
Be sure to write in the comments section, upon check out of your quote request, which custom size dimensions you need. Our team will then reach out for your specific drawing to complete your quote request.
Product Features
- Ultra low deflection force requirements
- High thermal conductivity
- High tack surface reduces contact resistance
- UL 94 V-0 flammability rated
- RoHS compliant
Typical Applications
- Telecommunications equipment
- Consumer electronics
- Automotive electronics (ECUs)
- LEDs & lighting
- Power conversion
- Desktop computers, laptops, servers
- Handheld devices
- Memory modules
- Vibration dampening
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RESOURCES
THERM-A-GAP PAD 10: The Ultimate Solution for Thermal Management
The THERM-A-GAP PAD 10 is a breakthrough in thermal interface materials, offering an ultra-low hardness of 35 Shore 00 and an impressive thermal conductivity of 1.0 W/m-K. This combination makes it an ideal choice for applications requiring minimal deflection force and optimal heat dissipation. Whether you are designing consumer electronics, automotive ECUs, or LED lighting systems, THERM-A-GAP PAD 10 ensures effective thermal management without compromising on performance.
Solving Overheating Issues in Computers and Servers: THERM-A-GAP PAD 10
In the fast-paced world of computing, overheating is one of the most critical challenges affecting the performance, longevity, and reliability of systems. Computers and servers generate significant heat, and without proper thermal management, components can degrade, slow down, or even fail. Parker Chomerics has introduced the THERM-A-GAP PAD 10, a thermally conductive gap filler pad designed to address this issue effectively. With its ultra-low hardness and excellent thermal conductivity, this solution ensures optimal heat dissipation, keeping computing systems running smoothly and efficiently.
Selecting Between Thermal Gap Filler Pads and Thermal Gels
Discover the typical properties of thermal gap pads, also known as thermally conductive gap filler pads or simply just gap filler pads.
These soft, conformable pads are designed to reduce component stress and help with vibration dampening.
Different gap filler pads have different specifications depending on use of application, performance requirements, and much more. Watch the video to learn more about the properties of thermally conductive gap filler pads.
Embrace the Global Advantage in Manufacturing
EMC Considerations for Product Designers and Engineers
If you are a product designer or engineer who wants to know about the many solutions for electrmagnetic interference (EMI) shielding or simply wanted a refresher on the basics of EMC, this webinar is for you. You will learn the theory behind EMC, the products available to meet EMC regulations, the basics of testing for EMI/RF compliance, and hear about real-world application examples.
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