INTRODUCING
THERM-A-GAP PAD 30RB
3.0 W/m-K Thermally Conductive Reboundable Gap Filler Pad
Thermal Interface Materials Catalog
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Product Features
- 3.0 W/m-K thermal conductivity
- Very low compression force
- Reboundable
- Vibration dampening
- Reusable
Parker Chomerics THERM-A-GAP® PAD 30RB is a thermally conductive, reboundable gap filler pad with a thermal conductivity of 3.0 W/m‐K. This gap pad offers excellent conformability and superior recovery properties, enabling it to effectively accommodate high stack-up tolerances while minimizing compressive loads and absorbing shock. With superior rebound property, it can be compressed and reapplied multiple times with minimal height loss and retains the same thermal performance as a fresh pad.
THERM‐A‐GAP PAD 30RB is offered as a standalone material, with both sides naturally tacky for secure placement during assembly. Alternatively, it can be supplied with one side tacky and the opposite side non-tacky. This ensures the pad remains in position during assembly, while also facilitating easy disassembly and reuse.
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THERM-A-GAP PAD 30RB
More THERM-A-GAP Thermal Gap Filler Pads
Product Name
Thermal Conductivity
Datasheet
THERM-A-GAP PAD 30
3.0 W/m-K
Technical Datasheet
More Resources
Higher Reboundability for IT and Testing Applications
To achieve reboundable performance, we took the formulation of THERM-A-GAP PAD 30 and modified some of the polymers within the binder system to make them rebound a little bit faster. PAD 30RB is in line with many of the current thermal performance needs required by electronics applications.
Thermal Solutions for Tight Semiconductor Cavities
At Parker Chomerics, we’re continually innovating to help our clients meet their applications’ thermal management needs. One specific area of focus for us is thermal phase change materials, which typically start as a solid or paste then go through a phase transition and effectively melt once they are heated.
Improved Thermal Management for Liquid Cooling Features in Data Centers
Parker Chomerics has several products that work well in these applications, including phase change materials and thermal greases. For applications with larger gaps, our thermal gap pads and thermal gels can be great choices as well.
Next-Gen Thermal Gap Pads: Higher Conductivity, Better Compliance, Easier Assembly
Thermal interface gap pads (thermal pads) remain one of the most widely used TIMs for bridging mechanical tolerances while maintaining reliable heat transfer—especially in EV power electronics, telecom, servers, and industrial controls. In this video, we cover the latest gap pad product trends and new developments shaping 2026, with practical guidance for selecting pads that perform and assemble consistently.
Embrace the Global Advantage in Manufacturing
EMC Considerations for Product Designers and Engineers
If you are a product designer or engineer who wants to know about the many solutions for electrmagnetic interference (EMI) shielding or simply wanted a refresher on the basics of EMC, this webinar is for you. You will learn the theory behind EMC, the products available to meet EMC regulations, the basics of testing for EMI/RF compliance, and hear about real-world application examples.
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