INTRODUCING
THERM-A-GAP PAD 60
6.0 W/m-K Thermally Conductive Low Compression Force Gap Filler Pad
Parker Chomerics THERM-A-GAP PAD 60 is a high performance, thermally conductive gap filler pad with a thermal conductivity of 6.0 W/m-K. It provides excellent heat transfer and low compression forces while still maintaining conformability between mating surfaces.
THERM-A-GAP PAD 60 offers the combination of both excellent thermal conductivity and conformability, along with very low outgassing to provide an effective thermal interface between heat sinks and electronic devices where uneven surfaces, air gaps and rough surface textures may exist.
THERM-A-GAP PAD 60 is manufactured to size and facilitates easy application on the desired component.
Product Features
- 6.0 W/m-K thermal conductivity
- Low compression force
- High thermal conductivity
- “A” version offers high strength acrylic PSA for permanent attachment
- UL recognized V-0 flammability
- RoHS compliant
Typical Applications
- 5G telecom equipment
- Smart home devices
- Automotive electronics (ECUs)
- LEDs
- Power supplies
- Desktop computers, laptops, servers
- Handheld devices
- Memory modules
- Vibration dampening
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THERM-A-GAP PAD 60
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More THERM-A-GAP Thermal Gap Filler Pads
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Thermal Conductivity
Datasheet
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This Is the Next Generation High Performing Thermal Gap Filler Pad
THERM-A-GAP PAD 60 offers the enticing combination of both excellent thermal conductivity at 6.0 W/m-K, at a softness of 31 Shore 00. This makes THERM-A-GAP PAD 60 more than 40% softer than current-like-performance thermal gap pads from Parker Chomerics.
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