Introducing
THERM-A-GAP PAD 70TP
7.0 W/m-K Thermally Conductive Very Low Compression Force Thermal Putty Sheet Material
Parker Chomerics THERM‐A‐GAP PAD 70TP is a high performance, highly conformable thermally conductive gap filler pad with a typical thermal conductivity of 7.0 W/m‐K. It provides superior thermal performance and long‐term stability over conventional thermal pads with very low compression force.
THERM‐A‐GAP PAD 70TP is designed to provide effective heat transfer between electronic components and their associated cooling features such as heat sinks. The physical properties of this gap pad allow it to exhibit very high conformability and minimize the compressive load on underlying electronics. “TP” in the product name stands for “Thermal Putty” indicating that, unlike other gap pads, this material is meant for static, one‐time assembly because it will permanently conform to displace air gaps caused by uneven surfaces or rough surface textures.
THERM‐A‐GAP PAD 70TP is offered as a standalone material, or with one of several carrier options; a woven glass carrier; either offset to one surface for a clean break feature (G carrier) or located approximately in the center of the part thickness (F carrier), both offering improved tear resistance and easier handling. There is also an aluminum foil carrier (A carrier) option with a pressure sensitive acrylic adhesive (PSA) on one side.
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Protect Equipment with a High-Performing Gap Filler Pad
New from Parker Chomerics is the THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pad. This ultra-soft, ultra-conformable, high-performance product provides a very low hardness (15 Shore 00) solution with 7.0W/m-K thermal conductivity. THERM‐A‐GAP PAD 70TP is designed to provide effective heat transfer between electronic components and their associated cooling features such as heat sinks.
Solutions for 5G mm Wave Technology
Don’t let the complexity of shielding for electromagnetic interference (EMI) get in the way of designing for the future of mmWave 5G connectivity. Our engineers at Parker Chomerics are experts in creating EMI and thermal solutions for 5G mmWave applications, giving you a wealth of integrated, multi-technology systems and components that meet or exceed your specifications and expectations.
Selecting Between Thermal Gap Filler Pads and Thermal Gels
Discover the typical properties of thermal gap pads, also known as thermally conductive gap filler pads or simply just gap filler pads.
These soft, conformable pads are designed to reduce component stress and help with vibration dampening.
Different gap filler pads have different specifications depending on use of application, performance requirements, and much more. Watch the video to learn more about the properties of thermally conductive gap filler pads.
Embrace the Global Advantage in Manufacturing
EMC Considerations for Product Designers and Engineers
If you are a product designer or engineer who wants to know about the many solutions for electrmagnetic interference (EMI) shielding or simply wanted a refresher on the basics of EMC, this webinar is for you. You will learn the theory behind EMC, the products available to meet EMC regulations, the basics of testing for EMI/RF compliance, and hear about real-world application examples.
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