INTRODUCING
THERM-A-GAP PAD 80
8.3 W/m-K Thermally Conductive Low Compression Force Gap Filler Pad
Parker Chomerics THERM-A-GAP PAD 80 is a high performance, thermally conductive gap filler pad with a typical thermal conductivity of 8.3 W/m-K. It provides superior heat transfer across a range of thicknesses while maintaining low compression forces and conformability between mating surfaces.
THERM-A-GAP PAD 80 is designed to serve as an effective thermal interface between heat sinks and heat generating components on electronic devices where uneven surfaces, air gaps, and rough surfaces may exist.
PAD 80 is available in standard thicknesses as low as 0.020” to 0.200” (0.50mm to 5.1mm) and can be provided in sheets or cut to custom part sizes. It is available on several material carriers including an aluminum foil carrier that is supplied with pressure sensitive adhesive (PSA) for added adhesive strength during the assembly process.
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More THERM-A-GAP Thermal Gap Filler Pads
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More THERM-A-GAP Thermal Gap Filler Pads
Performance and Elastomeric Benefits in One Thermally Conductive Gap Filler Pad
We’re pleased to introduce THERM-A-GAP™ PAD 80, the highest performing gap pad from Parker Chomerics. This pad has a thermal conductivity of 8.3 W/m-K, much higher than the 3-5 W/m-K range commonly seen in thermal pads these days. It is perfectly suited for applications where high temperatures are likely and performance can’t be scarified, providing superior heat transfer across a range of thicknesses while maintaining low compression forces and conformability between mating surfaces.
Solutions for Aerospace & Defense
The engineers at Parker Chomerics are experts in creating EMI shielding and thermal solutions for military and aerospace applications, giving you a wealth of integrated, multi-technology systems and components that meet or exceed your specifications and expectations. Learn more about Parker Chomerics solutions for aerospace and defense applications.
This Is the Next Generation High Performing Thermal Gap Filler Pad
Parker Chomerics THERM-A-GAP gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface.
Embrace the Global Advantage in Manufacturing
EMC Considerations for Product Designers and Engineers
If you are a product designer or engineer who wants to know about the many solutions for electrmagnetic interference (EMI) shielding or simply wanted a refresher on the basics of EMC, this webinar is for you. You will learn the theory behind EMC, the products available to meet EMC regulations, the basics of testing for EMI/RF compliance, and hear about real-world application examples.
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