The highest thermal conductivity thermal interface material gap filler pad from Parker Chomerics with 8.3 W/m-K thermal conductivity.
Parker Chomerics THERM-A-GAP PAD 80 is a high performance, thermally conductive gap filler pad with a typical thermal conductivity of 8.3 W/m-K. It provides superior heat transfer across a range of thicknesses while maintaining low compression forces and conformability between mating surfaces.
THERM-A-GAP PAD 80 is designed to serve as an effective thermal interface between heat sinks and heat generating components on electronic devices where uneven surfaces, air gaps, and rough surfaces may exist.
PAD 80 is available in standard thicknesses as low as 0.020” to 0.200” (0.50mm to 5.1mm) and can be provided in sheets or cut to custom part sizes. It is available on several material carriers including an aluminum foil carrier that is supplied with pressure sensitive adhesive (PSA) for added adhesive strength during the assembly process.