Introducing
THERM-A-GAP PAD 80LOE
8.0 W/m-K High Performance, Low Oil Bleed, Low Relaxation Force Thermal Gap Filler Pad
Parker Chomerics THERM-A-GAP™ PAD 80LOE is a high performance, low oil bleed, thermal gap filler pad with a typical thermal conductivity of 8.0 W/m-K. PAD 80LOE was developed to be a high reliability and long-term solution for mission critical and high-performance electronics in nearly every market segment including advanced computing, defense electronics, telecommunications infrastructure, and automotive modules.
“LOE” in the product name stands for “Low Oil” and "Enhanced", indicating the very low silicone oil bleed and migration properties of this gap pad. PAD 80LOE is meant to be used where the aesthetic or manufacturing issues of silicone oils can be a concern.
PAD 80LOE brings improved softness with a hardness of 60 Shore 00 and exhibits excellent stress relaxation over time, with a nearly 90% reduction in compression force after just one hour. It is designed to impart minimal stress on components such as integrated circuits and provide physical protection such as vibration dampening while maintaining effective thermal contact where conformability in gaps or rough surface texture is a concern.
PAD 80LOE can be provided in sheets or die cut to custom part sizes and is available in standard thicknesses as low as 0.040” to 0.200” (1.0 mm to 5 mm).
Product Features
- High thermal performance: 8.0 W/m-K conductivity
- Very low oil bleed and migration
- Very low compression force post-relaxation
- High tack surface reduces contact resistance
- Electrically isolating
- UL 94 V-0 flammability rating
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RESOURCES
Why High Thermal Performance Alone isn’t Enough Anymore: The Next Generation of Thermal Gap Filler Pad
AI Processing Hardware. Telecommunications Infrastructure. Advanced Automotive Electronics. Mission Critical Avionics and Defense Electronics. IoT Modules. Wearable Medical Devices. THERM-A-GAP PAD 80LOE represents a modern solution to the next generation of electronics thermal management.
EMI Shielding, Thermal Interface Materials & Integrated Assemblies for Automotive Innovation
Top OEMs and Tier automotive suppliers turn to Parker Chomerics to help them solve complex engineering and design challenges. We have an extensive range of EMI shielding, thermal interface materials and injected molded plastics solutions that support advanced driver assistance systems (ADAS) and fit seamlessly into integrated assemblies.
Selecting Between Thermal Gap Filler Pads and Thermal Gels
Discover the typical properties of thermal gap pads, also known as thermally conductive gap filler pads or simply just gap filler pads.
These soft, conformable pads are designed to reduce component stress and help with vibration dampening.
Different gap filler pads have different specifications depending on use of application, performance requirements, and much more. Watch the video to learn more about the properties of thermally conductive gap filler pads.
Embrace the Global Advantage in Manufacturing
EMC Considerations for Product Designers and Engineers
If you are a product designer or engineer who wants to know about the many solutions for electrmagnetic interference (EMI) shielding or simply wanted a refresher on the basics of EMC, this webinar is for you. You will learn the theory behind EMC, the products available to meet EMC regulations, the basics of testing for EMI/RF compliance, and hear about real-world application examples.
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