INTRODUCING
THERM-A-GAP GEL 30
3.5 W/m-K High Performance Fully Cured Dispensable GEL
Parker Chomerics THERM-A-GAP Gel 30 is a fully cured dispensable gel designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. It requires no mixing or curing, providing superior design flexibility.
Product Attributes
- Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders
- Proven reliability in extreme temperature cycling and shock & vibration
- Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.
- Accommodates a variety of bond line thicknesses for application to multiple devices
- Successfully used to fill a variety of different gap thickness
- Compatible with high volume, automated dispense processes
- Meets Telcordia (Bellcore) silicone specifications
Product Features
- Easily dispensable
- Fully-cured/ No pump out
- High bulk thermal conductivity
- Low thermal impedance
- Ultra low compression force
- High tack surface & reworkable
- Proven long-term reliability
Typical Applications
- Automotive electronic control units (ECUs)
- Power supplies & semiconductors
- Memory and power modules
- Microprocessors and graphics processors
- Flat panel displays & consumer Electronics
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THERM-A-GAP GEL 30
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Parker Chomerics’ manufacturing operations span the globe, allowing us to serve you locally no matter where you are. We understand your unique needs and provide personalized solutions that cater to your specific requirements.
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