As the global leader in the development and manufacture of thermal interface material (TIMs) for electronic thermal management, Parker Chomerics is constantly launching new materials to address unmet needs. In this webinar, you will learn about new products in the thermal gap pad, thermal gel, thermal dispensable gap filler, and thermal grease families that have been launched in the last year.
We will share the general trends in electronics design that are driving the need for innovation and the key properties that differentiate these new products from legacy solutions. Lastly, you will hear about our product validation, qualification, and testing processes and get a sneak peek into our product roadmap with details on materials to be launched in the near future.
In This Virtual Event, You Will Learn About:
- Two new thermal gap pad offerings
- Two new thermal gel offerings
- Two new dispensable gap filler offerings
- Four new thermal grease offerings
- See our roadmap for upcoming thermal interface material development