WEBINAR
2024 Thermal Interface Material Innovations
Over the last year, Parker Chomerics has developed new, state of the art thermal interface materials, or TIMs, for use across industries and applications. These novel products continue to expand the portfolio of high performance, high reliability thermal gap pads and dispensable thermal gels.
The Telecommunications, Energy Storage, Automotive, Defense, Aerospace, Consumer Electronics, and Industrial markets are pushing the boundaries of heat management within high-power electronics components such as single chips, multi- chip modules, integrated circuits, etc. and looking to thermal interface materials to ensure long product life and consistent performance.
In This Virtual Event, You Will Learn About:
- Learn about the three new dispensable thermal gels
- Learn about our reliability testing and new product validation processes
- See our roadmap for upcoming thermal interface material development
Get a Free Sample of
THERM-A-GAP GELs
Product Features and Benefits:
- Dispensable
- Fully cured
- Highly conformable at low pressures
- Vertical orientation of cartridge during storage
- Single dispensable TIM can eliminate multiple pad part sizes/numbers
- Reworkable
Embrace the Global Advantage in Manufacturing
EMC Considerations for Product Designers and Engineers
If you are a product designer or engineer who wants to know about the many solutions for electrmagnetic interference (EMI) shielding or simply wanted a refresher on the basics of EMC, this webinar is for you. You will learn the theory behind EMC, the products available to meet EMC regulations, the basics of testing for EMI/RF compliance, and hear about real-world application examples.
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