Introducing
THERM-A-GAP GEL 75
The highest thermal conductivity dispensable thermal interface material from Parker Chomerics. 7.5 W/m-K thermal conductivity with 30 g/min flow rate.
Parker Chomerics THERM-A-GAP GEL 75 is a high performance, one component, dispensable thermal interface material with 7.5 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.

The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

It is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.
Product Features
  • Thermal conductivity: 7.5 W/m-K
  • Easily dispensed
  • No secondary curing required
  • Low thermal impedance
  • Very low compression force
  • Reworkable
Typical Applications
  • Telecom base stations
  • Power supplies and semiconductors
  • Memory and power modules
  • Microprocessors
  • Central processing units (CPUs)
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THERM-A-GAP GEL 75

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