Introducing
THERM-A-GAP GEL 75

A thermally conductive gap filler

  • The highest thermal conductivity dispensable thermal interface material from Parker Chomerics
  • 7.5 W/m-K thermal conductivity with 30 g/min flow rate
Parker Chomerics THERM-A-GAP GEL 75 is a high-performance, dispensable thermal interface material with 7.5 W/m-K thermal conductivity. Part of a family of one-component dispensable gap fillers, THERM-A-GAP GEL 75 was developed to conduct heat from electronics to a heat sink or enclosure.

The heavy paste-like consistency of this thermal putty enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure, subjecting components, solder joints and leads to minimal stresses.

THERM-A-GAP GEL 75 is formulated to accommodate the thermal compound requirements of today’s high-performance electronics and is ideal for automated dispensing machines, rework and field repair situations. Parker Chomerics is a global leader in designing and producing dispensable thermal gels and thermally conductive gap fillers.

Product Features of THERM-A-GAP GEL 75, a Thermal Gap Filler

  • Thermal conductivity: 7.5 W/m-K
  • Easily dispensed thermal paste
  • No secondary curing required
  • Low thermal impedance
  • Very low compression force
  • Reworkable

Typical Applications for Thermally Conductive Gels

  • Telecom base stations
  • Power supplies and semiconductors
  • Memory and power modules
  • Microprocessors
  • Central processing units (CPUs)
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RESOURCES
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Lightning-fast speeds and effectively imperceptible latency are no longer a part of the conversation for the future of connectivity, but rather are already available to consumers. With the recent rollout of Wi-Fi 6E and the upcoming rollout of Wi-Fi 7, consumers and networking hardware manufacturers have a whole lot to be excited about. To meet the challenges of advancing technology, designers must look to the next generation of thermal interface materials and EMI shielding/grounding solutions.
What Are THERM-A-GAP GELs?
THERM-A-GAP GELs are highly conformable, single-component thermal dispensable compounds that require no cure. Once dispensed, they hold their shape and are ideal for applications where stability and long term reliability is required. They are available in silicone and silicone-free formulations and are ideally suited for high volume applications.
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