Parker Chomerics THERM-A-GAP GEL 75 is a high-performance, dispensable thermal interface material with 7.5 W/m-K thermal conductivity. Part of a family of one-component dispensable gap fillers, THERM-A-GAP GEL 75 was developed to conduct heat from electronics to a heat sink or enclosure.
The heavy paste-like consistency of this thermal putty enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 75 requires low compressive force to deform under assembly pressure, subjecting components, solder joints and leads to minimal stresses.
THERM-A-GAP GEL 75 is formulated to accommodate the thermal compound requirements of today’s high-performance electronics and is ideal for automated dispensing machines, rework and field repair situations. Parker Chomerics is a global leader in designing and producing dispensable thermal gels and thermally conductive gap fillers.