GAP FILLER, GAP PAD and SIL PAD Alternative Cross To Materials
Thermal interface materials are designed for effective and reliable electronics cooling in a variety of applications.
Discover below Parker Chomerics product alternatives for thermal gap fillers.
The product name and its closest corresponding thermal gap filler or thermal gap pad are shown in the Parker Chomerics product family that may work in your application. You will be able to click directly onto the product, which will bring up the Parker Chomerics website; giving you more detailed product information and the ability to request a product quote or sample.
Our application and sales engineers are standing by to answer your questions about qualifying our alternatives in your application. Please reach out to us, we look forward to helping you.
GAP FILLER TGF Thermal Alternative Cross To
| Product | Available Parker Chomerics Alternative |
|---|---|
| GAP FILLER TGF 1000 | THERM-A-FORM T646 |
| GAP FILLER TGF 1000SR | THERM-A-FORM T646 |
| GAP FILLER TGF 1450 | THERM-A-FORM T647 or THERM-A-FORM T642 |
| GAP FILLER TGF 1500 | THERM-A-FORM T647 or THERM-A-FORM T642 |
| GAP FILLER TGF 1500G | THERM-A-FORM T647 or THERM-A-FORM T642 |
| GAP FILLER TGF 1900 | THERM-A-FORM T647 |
| GAP FILLER TGF 2000 | THERM-A-FORM T647 |
| GAP FILLER TGF 3600 | THERM-A-FORM CIP 35 |
| GAP FILLER TGF 4000 | THERM-A-FORM CIP 35 |
| GAP FILLER TGF 900SR | THERM-A-FORM T646 |
Thermal gap filler and gap filling adhesives such as Parker Chomerics THERM-A-FORM™ two-part liquid gap filling systems are thermally conductive silicone elastomer products.
These thermal products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. Cures in place once dispensed and ideal for gap filling, potting, sealing and encapsulating.
GAP PAD TGP Thermal Alternative Cross To
| Product | Available Parker Chomerics Alternative |
|---|---|
| GAP PAD TGP 1000HD | THERM-A-GAP HCS10 or THERM-A-GAP PAD 30 |
| GAP PAD TGP 1300 | THERM-A-GAP PAD 30 |
| GAP PAD TGP 1300U | THERM-A-GAP PAD 30 |
| GAP PAD TGP 2000 | THERM-A-GAP PAD 30 |
| GAP PAD TGP 2400 | THERM-A-GAP PAD 30 |
| GAP PAD TGP 3000 | THERM-A-GAP PAD 30 |
| GAP PAD TGP 5000 | THERM-A-GAP PAD 60 |
| GAP PAD TGP A2000 | THERM-A-GAP 569 |
| GAP PAD TGP A2600 | THERM-A-GAP PAD 30 |
| GAP PAD TGP HC1000 | THERM-A-GAP HCS10 |
| GAP PAD TGP HC5000 | THERM-A-GAP PAD 60 |
GAP PAD TGP alternatives include THERM-A-GAP gap filler pads from Parker Chomerics.
THERM-A-GAP gap filler pads are thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface.
SIL PAD TSP Thermal Dielectric Alternative Cross To
| Product | Available Parker Chomerics Alternative |
|---|---|
| SIL PAD TSP 1100ST | CHO-THERM T441-13 |
| SIL PAD TSP 1800 | CHO-THERM T500 or CHO-THERM 1671 |
| SIL PAD TSP 1800ST | CHO-THERM T500 |
| SIL PAD TSP A2000 | CHO-THERM 1678 |
| SIL PAD TSP A3000 | CHO-THERM 1671 |
As a recommended replacement for SIL PAD thermal materials, CHO-THERM® Thermal Insulator Pads are designed for use as alternatives to greased mica insulators between discrete power devices and heat sinks. These alternatives to SIL PAD products are offered as dry pads, or with an optional acrylic adhesive (PSA) layer for attachment.
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Parker Hannifin Chomerics Division
77 Dragon Ct., Woburn, MA 01801
781-935-4850