CASE STUDY
High Performance Thermal Gap Pad for Smart Home Device
Discover how a global manufacturer of smart home devices used a high thermal conductivity thermal gap pad from Parker Chomerics to effectively dissipate heat from both CPU and RAM ICs.
Smart Home Device Thermal Management Customer Challenge
A global manufacturer of smart home devices required a high thermal conductivity gap filler pad to effectively dissipate heat from a CPU and RAM ICs to a cooling plate within a housing.
Smart home devices are proliferating our everyday world, with popular products from both large multinational technology players and scrappy startups alike, there are endless smart home products available on the marketplace today. With each iteration and design cycle, smart home devices are expected to include more features and achieve greater performance, thus driving the need for increased thermal interface material (TIM) performance.
Critical Material Requirements
- Elastomeric gap filler pad for heat dissipation
- Soft and easily conformable
- Thin, able to be easily die cut to size
- Applied via robotic arm for high volume applications
- Cooling of CPU and RAM ICs from metal can to metal housing chassis
Customer Specific Requirements
- Ease of application
- Global availability near manufacturing location
- Pick and place robotic assembly
- Thermal impedance of <0.30 °C-in2/W
- Thickness of 1.5 mm or less
- Thermal conductivity of >5 W/m-K
Parker Chomerics THERM-A-GAP™ PAD 60 is an ultra-soft, ultra-conformable high performance thermally conductive gap filler pad with 6.0 W/m-K thermal conductivity.
Smart Home Device TIM Gap Pad Solution
Smart devices require thermal gap filler pads to effectively dissipate heat generated not only from dual band Wi-Fi and Bluetooth controllers, but also high-end processors which support many CPU cores and features.
THERM-A-GAP PAD 60, the next generation of thermal gap filler pads from the THERM-A-GAP family of thermal interface materials, was selected as the thermal gap pad solution as it provides an efficient thermal exchange between the processor Integrated Heat Spreader (IHS) and heatsink on smart home PCBs.
Designed with performance in mind, THERM-A-GAP PAD 60 offers a 6.0 W/m-K thermal conductivity and a very low hardness of 31 Shore 00. The Shore 00 hardness scale covers very soft materials like rubbers, foams, sponges, and gels. A 31 Shore 00 result equates to approximately the hardness of a gel-like shoe insole.
Parker Chomerics THERM-A-GAP™ PAD 60 is an ultra-soft, ultra-conformable high performance thermally conductive gap filler pad with 6.0 W/m-K thermal conductivity.
Conclusion and Summary
THERM-A-GAP PAD 60’s combination of high thermal conductivity and ultra-soft conformability, along with very low NASA outgassing, provides an effective thermal interface between heat sinks and electronic devices where uneven surfaces, air gaps and rough surface textures may exist.
Since installation, our customer has sold tens of thousands of smart home devices with effective
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Parker Hannifin Chomerics Division
77 Dragon Ct., Woburn, MA 01801
781-935-4850